Introduction In modern power module design, thermal management and thermo-mechanical reliability are two critical considerations. As the insulating and heat-transfer layer between semiconductor devices and the cooling system, ceramic substrates play an important role in thermal performance, electrical insulation, and long-term
Al₂O₃ vs AlN vs Si₃N₄: Which Is Best for Power Modules? Keep Reading »
Introduction In high-temperature sintering, electronic ceramic tape casting, and semiconductor component processing, alumina setter plates are widely used as critical support fixtures due to their excellent high-temperature resistance and chemical stability. However, during actual service, many manufacturers encounter unexpected cracking or
Why Alumina Setter Plates Crack: Failure Analysis and Solutions Keep Reading »
Introduction A common challenge engineers face when selecting engineering ceramic materials is this: They check datasheets, compare material properties, and review similar applications, believing that they have considered everything carefully. However, after the ceramic parts are manufactured and put into service
7 Common Mistakes in Ceramic Material Selection and Design Keep Reading »
Introduction Advanced technical ceramics have become essential materials in demanding applications such as semiconductor manufacturing, aerospace systems, high-voltage equipment, and precision machinery due to their excellent properties, including high-temperature resistance, electrical insulation, wear resistance, and dimensional stability. However, unlike metals,
Introduction When discussing advanced ceramics in electronic packaging, many people first think of ceramic substrates. Whether power modules should use Al₂O₃ or AlN, and whether DBC or AMB technology is more suitable, has already been extensively discussed in technical literature.
Advanced Ceramics for Electronic Packaging: Beyond Ceramic Substrates Keep Reading »
