Introduction When designing a grinder, the designer often faces the decision of whether to use ceramic burrs or stainless steel burrs. In reality, both have their pros and cons. The choice depends on the specific application and requirements. This article will […]

Introduction Ceramic substrates are the core support for heat dissipation and insulation in power modules. Their performance directly affects the module’s reliability, heat dissipation capacity, and lifespan. Currently, the market is mainly focused on three materials: Al₂O₃ (alumina), AlN (aluminum

Introduction Ceramic substrate warpage is the invisible killer in the power module packaging process. Once warpage occurs, subsequent chip mounting and wire bonding stages are bound to encounter serious problems. A series of failures, such as solder joint voids, chip

Introduction In electronic ceramics production, metallization and nickel plating are key factors affecting device reliability and lifespan. Customers often ask: “Why does the nickel plating on metallized ceramics delaminate?” and “The nickel plating passes testing, but peeling and delamination occur

Introduction Hermetic seal failure in metallized ceramics is a common reliability issue in electronic packaging, directly affecting device lifespan and stability. This paper systematically analyzes the causes of hermetic seal failures and, based on microstructural images and process data, provides preventive