Introduction Ceramic substrates are the core support for heat dissipation and insulation in power modules. Their performance directly affects the module’s reliability, heat dissipation capacity, and lifespan. Currently, the market is mainly focused on three materials: Al₂O₃ (alumina), AlN (aluminum […]

Introduction Ceramic substrate warpage is the invisible killer in the power module packaging process. Once warpage occurs, subsequent chip mounting and wire bonding stages are bound to encounter serious problems. A series of failures, such as solder joint voids, chip

Introduction In applications such as electric vehicles (EVs), industrial drives, and photovoltaic inverters, the power density of power modules continues to increase, leading to a significant increase in internal heat generation. Based on experience from actual projects, we believe that

Introduction Among numerous advanced ceramic products, ceramic substrates  offer excellent thermal conductivity and strong insulation, making them ideal for high-end chips and power modules. Considering ease of processing and cost, ceramic substrates are typically produced through tape casting. However, their