Professionalism Leads to Quality
We have integrated technologies from materials to products in-house that enables us to produce customized aluminum nitride substrates that suit your needs.
- Tailored sizes, shapes and precision
- Premium quality at a cost-effective price
- Reliable delivery to meet your tight deadlines
Your Reliable Partner for Aluminum Nitride Substrates
We are a professional manufacturer of aluminum nitride substrates, with customized options for shapes and dimensions to meet specific requirements. Our expertise isn’t only in theoretical knowledge, but also in rich manufacturing experience since 2008.
Our aluminum nitride substrates can help you improve the performance of your electronic devices. They have excellent thermal conductivity, electrical insulation, and mechanical strength, as well as a coefficient of thermal expansion that matches Si, allowing them to quickly dissipate heat, protect valuable components, and improve device reliability and service life.
If you need aluminum nitride substrates, please contact us today.
By Features
We manufacture various types of aluminum nitride substrates in different sizes, shapes, processes, etc.
The most common sizes are 50.8*50.8mm, 114*114mm and 140*190mm.
Such as φ150 large diameter aluminum nitride wafers.
The surface is polished to achieve extremely high smoothness and flatness.
Use laser cutting, drilling or engraving technology for high-precision and complex structure.
The Processing Technology of Aluminum Nitride Substrates
Due to the high hardness and brittleness of the material, it is not easy to process aluminum nitride ceramic blocks into substrates that meet specific requirements. It requires a series of precise and complex processing techniques. This article will introduce the main processing techniques of aluminum nitride substrates in detail to help you better understand this process.
- Cutting
Cutting is the first step in aluminum nitride substrate processing, and its purpose is to cut a large piece of aluminum nitride ceramic block into a substrate of the required size. Common cutting methods include diamond cutting and laser cutting. Diamond cutting is suitable for thicker substrates, while laser cutting is suitable for cutting with high precision and complex shapes. The cutting speed and pressure need to be strictly controlled during the cutting process to avoid material breakage or edge damage.
- Drilling
Drilling is the process of machining through holes or blind holes on aluminum nitride substrates to meet circuit connection or heat dissipation requirements. The drilling process usually uses diamond drill bits or laser drilling technology. When drilling, we need to pay attention to the accuracy of the hole position and the smoothness of the hole wall to ensure the quality of the subsequent metallization process.
- Lapping
Lapping is mainly used for the initial flattening of aluminum nitride substrates, especially in applications that require high flatness and thickness accuracy. By using a lapping disc and lapping fluid, the tiny unevenness on the substrate surface is removed to achieve a higher flatness and thickness consistency.
- Polishing
Polishing is mainly used for the final surface treatment of aluminum nitride substrates, especially in applications that require extremely high surface finishes. Polishing removes tiny scratches and surface defects remaining after lapping by using finer abrasive particles and soft polishing pads.
- Metallization
Metallization is the process of depositing a metal layer on the surface of an aluminum nitride substrate to form a circuit pattern. Common metallization methods include sputtering, electroplating, and chemical plating. Sputtering is suitable for high-precision, small-area metallization; electroplating and chemical plating are suitable for large-area or complex-shaped metallization. The metallization layer is usually made of materials such as copper, aluminum, or gold to meet the requirements of conductivity and corrosion resistance.
Conclusion
The processing technology of aluminum nitride substrate is a complex and highly technical process, which requires careful design and operation of multiple steps to ensure that the final product has excellent performance and quality.
Aluminum nitride substrates have significant advantages over other ceramic substrates (such as alumina, silicon nitride, beryllium oxide substrates, etc.). Below we will list the three most important ones.
- High thermal conductivity
The thermal conductivity of aluminum nitride substrates (≥170W/(m·K)) is much higher than that of alumina substrates (about 24 W/(m·K)) and close to that of beryllium oxide substrates (about 250W/(m·K)). However, beryllium oxide is toxic, which limits its application.
- Low thermal expansion coefficient
The thermal expansion coefficient of aluminum nitride substrate (about 4.5×10⁻⁶/K) is close to that of semiconductor materials (such as Si, SiC, GaN), which can reduce thermal stress and avoid device failure caused by temperature changes.
- Excellent electrical insulation
Aluminum nitride substrate has high resistivity and low dielectric constant, which can effectively isolate circuits and reduce signal loss.
Aluminum nitride substrates are widely used in high-power electronic devices, LED lighting, RF and microwave devices, automotive electronics, aerospace and other fields.
For example, in the field of LED lighting, aluminum nitride substrates can effectively dissipate the heat generated by LED chips and improve the luminous efficiency and life of LEDs. In the field of automotive electronics, aluminum nitride substrates can be used in engine control modules, power conversion modules, etc. to improve the reliability and safety of automobiles.
The price of aluminum nitride substrate is affected by many factors, such as size, thickness, process, accuracy, order quantity, etc. Generally speaking, the price of aluminum nitride substrate is higher than that of alumina substrate, but its excellent performance can bring higher cost performance. Please contact us for a quote.
Yes, the size and thickness of aluminum nitride substrates can be customized. Standard sizes include 50.8*50.8mm, 114*114mm, 140*190mm, etc., and the thickness range is usually 0.2mm to 1mm. For special applications, larger sizes or thinner/thicker substrates can also be provided.