BN - The "Swiss Army Knife" of Industry
In scenarios where heat dissipation, insulation, corrosion resistance, and thermal shock resistance need to be solved at the same time, h-BN is the only material that can meet all the needs.
- Semiconductor: the only material with both high thermal conductivity and insulation;
- Laser: high temperature resistance and laser damage resistance;
- High temperature industry: thermal shock resistance and molten metal corrosion resistance.
Boron Nitride Plate Factory
As a professional manufacturer of high-performance hexagonal boron nitride (h-BN) plates, Jinghui ceramic delivers exceptional thermal management solutions for industries demanding extreme heat resistance, electrical insulation, and chemical stability.
Our BN plates boast high thermal conductivity, low thermal expansion, and superior dielectric strength—ideal for electronics, high temperature and heat treatment, chemical and metallurgical industries.
We can provide custom boron nitride plate per request. With ISO-certified production, fast lead time, and competitive pricing, we’re the trusted partner for global OEMs and tech innovators. Request a datasheet or quote today.
By Applications
Boron nitride plates are used in many industrial fields due to their high thermal conductivity, electrical insulation, high temperature resistance and chemical stability.
Resistant to thermal shock and without contaminating fired products.
Used in glass furnaces, resistant to high temperatures and does not react with molten glass.
As a setter plate for solar cells, ensuring dimensional stability at high temperatures.
Resist corrosion from strong acids, alkalis and molten metals, extending equipment life.
Boron Nitride Plates Vs Alumina plates
If a photovoltaic company used hexagonal boron nitride (h-BN) plates to replace traditional alumina setter plates, successfully increasing the cell yield rate by 1.5%, which is equivalent to an annual efficiency increase of US$2.5 million. The key breakthroughs are:
- Perfect Thermal Matching
The thermal expansion coefficient of h-BN (4.5×10-6/℃) is highly consistent with that of silicon wafers, and the sintering deformation rate has been reduced from 5.1% to 1.7%.
- Excellent Process Performance
– Purity>99%, avoiding contamination of cells.
– Horizontal thermal conductivity 60W/m∙K, improved temperature uniformity.
– Anti-aluminum paste adhesion, 60% reduction in cleaning frequency.
- Long-Term Economic Efficiency
Although the unit price is 8 times that of alumina, the service life is extended by 4 times (2000 times vs. 500 times), and the payback period is only 4 months.
This case proves that in PERC/TOPCon cell production, 10-15mm thick h-BN plates can solve the yield, efficiency and cost issues at the same time.
Taking 95% alumina as an example, hexagonal boron nitride (h-BN) plates have significant advantages over 95% alumina (Al₂O₃) plates in the following properties.
- Thermal conductivity: The thermal conductivity of h-BN (30-60 W/(m·K)) is 1-2 times that of alumina (~30 W/(m·K)), and the heat dissipation is more efficient.
- Thermal shock stability: h-BN has a lower thermal expansion coefficient (close to silicon) and better thermal shock resistance.
- Machinability: The Mohs hardness of h-BN is only 2 (alumina is 9), and it can be directly machined into complex shapes.
- Electrical insulation: The dielectric strength of h-BN (30-40 kV/mm) is 2-3 times that of alumina.
Cubic Boron Nitride (c-BN) is a superhard crystal form of boron nitride (BN). Its atomic arrangement structure is similar to that of diamond (cubic crystal system). Its hardness is second only to diamond (microhardness is about 50 GPa), but it has higher thermal stability (temperature resistance up to 1400°C, diamond will oxidize at about 800°C in air).
Although cubic boron nitride (c-BN) is the “king” in the field of superhard materials, it is currently unable to be made into large-sized independent ceramic plates like h-BN due to the limitations of the synthesis process. It is mainly used in the form of cutting tools, abrasives and coatings.
Hexagonal boron nitride (h-BN) is named “white graphite” because its layered crystal structure and physical properties are highly similar to graphite, but its appearance is white.
The core differences between h-BN plate and graphite plate are shown in the table below.
| Feature | h-BN Plate | Graphite Plate |
| Color | White | Black |
| Electrical Property | Insulator (bandgap width ~5.9 eV) | Conductor (high in-plane conductivity) |
| Chemical Stability | Oxidation resistant (stable to 900°C in air) | Easy to oxidize (burn at >400°C in air) |
| Thermal Conductivity | In-plane 30-60 W/(m·K) (the best in insulators) | In-plane ~2000 W/(m·K) (ultra-high thermal conductivity) |
| Applications | High temperature insulation, electronic heat dissipation | Electrodes, thermal conductive materials |
The price of boron nitride plate is relatively high, and it belongs to high-end special ceramic materials. The core reasons for its high price are:
- High cost of raw materials: The price of high-purity boron nitride powder (>99%) is 20~50 times that of alumina powder.
- Complex process: Hot pressing sintering (HP-BN) requires high temperature (above 1800°C) + high pressure (20MPa), and the energy consumption and equipment cost are extremely high.
- Low production scale: Compared with alumina ceramics, the market demand for BN plates is small and the scale effect is weak.
We recommend that you weigh performance and cost according to application requirements.